Ericsson Careers

Master Thesis - Shape optimization of a heat sink

Stockholm, Sweden
Students and Young Professionals

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English (US)

Job Description

Date: Nov 9, 2018

Background

 

For each generation of electronic equipment there is a clear trend towards more heat per volume. The goal is to utilize the same volume to more efficiently transfer more heat from the unit. This can be done by exploring more complex and advanced heat sink geometries and optimizing the fin shape. To test many different shapes numerical simulation must be used to identify interesting geometries for further study.

 

Thesis Description

 

The target is to create an optimized heat sink that improves the heat transport. Once the student is familiar with electronics cooling, simulation techniques and the current state of art, the first step is to develop a workflow that is suitable to run many different cases. This means setup of CFD baseline which should be fast and give accurate results. Part of the process is the construction of a parameterized model of a heat sink, which could span a large variety of geometric shapes, sizes and known physical spatial criteria to name a few. The making of such a model requires analytical thinking, creativity and some experience. This model can be used together with optimization algorithms to find optimal performance. There are multiple target criteria that can be considered or optimized for, such as heat transfer, weight and volume, while still ensuring the manufacturability of the heat sink.

 

Main tasks and scope of the study include:

  • Pre-study and literature survey.
  • Creating a parameterized model of a heat sink.
  • Simulate the heat sinks and further the identification of important parameters to optimize heat sinks.

 

Qualifications

This project aims at students in thermodynamics, fluid mechanics, mechanical engineering, refrigeration and energy technology, physics or similar. Experience in using CFD simulation tools, such as Fluent, StarCCM+, CFX, FloTherm is required. Knowledge about optimization and CAD are merits.

 

Extent

1-2 students, 30hp each

 

Location

Ericsson AB, Kista, Stockholm

 

Preferred Starting Date

Spring 2019

 

Keywords

Electronics Cooling, CFD, Heat Transfer, Optimization, Fluid Dynamics, Telecommunication

 

Full Blend

 

Contact Persons

 

Tomas Muld                                                                Stevin van Wyk                                                                 

+46 70 832 3620                                                       +46 73 095 8659                                                                

tomas.muld@ericsson.com                                     stevin.van.wyk@ericsson.com

 

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Primary country and city: Sweden (SE) || || Stockholm || Stud&YP

Req ID: 258999